MeSH Browser

MeSH Supplementary: epoxy resin AH-26
Unique ID: C028044
RDF Unique Identifier: http://id.nlm.nih.gov/mesh/C028044
Entry Term(s): AH 26; AH-26; AH26 sealer
Registry Numbers: 55599-25-2
Previous Indexing: *DRUG COMBINATIONS (1982-2010); *ROOT CANAL FILLING MATERIALS (81-81)
Heading Mapped to: *Bismuth; *Epoxy Resins; *Root Canal Filling Materials; *Silver; *Titanium
Frequency: 336
Note: contains powder consisting of silver powder 10%, bismuth oxide 60%, hexamethylenetetramine 25% & titanium dioxide 5% & resin consisting of epoxybisphenol-resin 100%
Source: J Endodont 1980;6(10):784
Indexing Information: Root Canal Filling Materials
Date of Entry: 1981/02/11
Revision Date: 2010/07/02

Concept UI: M0090668
Registry Numbers: 55599-25-2
Terms: epoxy resin AH-26 Preferred Term
Term UI T120670
Date01/01/1955
LexicalTag LAB
ThesaurusID NLM (1981); AH 26
Term UI T120671
Date01/01/1955
LexicalTag LAB
ThesaurusID NLM (1981); AH-26
Term UI T120668
Date01/01/1955
LexicalTag LAB
ThesaurusID NLM (1981); AH26 sealer
Term UI T120669
Date01/01/1955
LexicalTag LAB
ThesaurusID NLM (1981)

epoxy resin AH-26 MeSH Supplementary Concept Data 2025