Solid Bond MeSH Supplementary Concept Data 2024

Details
Concepts

MeSH Supplementary: Solid Bond
Unique ID: C407604
RDF Unique Identifier: http://id.nlm.nih.gov/mesh/C407604
Registry Number: 0
Heading Mapped to: *Epoxy Compounds; *Methacrylates
Frequency: 22
Note: a bonding material
Source: Clin Oral Investig 1999 Dec;99(4):208-15
Indexing Information: Dentin-Bonding Agents
Date of Entry: 2000/05/11

Solid Bond Preferred

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