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Tri S Bond MeSH Supplementary Concept Data 2025


MeSH Supplementary
Tri S Bond
Unique ID
C521568
RDF Unique Identifier
http://id.nlm.nih.gov/mesh/C521568
Registry Numbers
0
Heading Mapped to
*Resin Cements
Frequency
1
Note
self-etching adhesive system containing 10-MDP, Bis-GMA, HEMA, hydrophobic dimethacrylate, di-camphorquinone, ethanol, water and silanated colloidal silica
Source
J Mater Sci Mater Med 2007 Jun;18(6):1111-6
Date of Entry
2007/08/01
Revision Date
2007/08/01
Tri S Bond Preferred
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